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You are here: Home » Technics » Process Capability
   Technics        >   Equipments       Process Capability       Production Process

PCB Process Capability

Description Parameters Remarks
Max layers number 30L  
Min  LW 3mil Copper Thickness 0.5 OZ
Min  LS 3mil Copper Thickness 0.5 OZ
Min welding ring Vias: 4mil Ring is welded to the hold edge distance of the outermost ring
Hole devices:5mil
Min hole diameter Through hole 0.15mm  
laser via hole 0.1mm  
Max thickness Single and  Double 0.2-6.0mm  
MLB 0.4-8.0mm  
Max Aspect Ratio finished 13:1  
Max Size Single and Double 600 x 1200mm  
MLB 500 x 1200mm  
Impedance Control Tolerance 土10%  
Solder Mask coloer Green, Blue, White, Black, Yellow, Red, Purple
Character White、Yellow、Black
Surface coating HASL、Electroless nickel/gold , Immersion Tin, Immersion Silver , OSP
Finished copper thickness outer layer 7 oz  
inner layer 6 oz  
Material FR4, ROGERS, ARLON, TACONIC, NELCO, ISOLA,  Al-base

PCBA Process Capability

Item Volume Prototype/Small Volume
PCB Specification of SMT Operation  Length x Width  Minimum 50x30 L<50 or W<30
Maximum 450x350 800≥l>450 or 400≥W>350
Thickness Thinnest 0.8 T<0.8
Thickest 5 T>5
PCB Specification of DIP Operation Length x Width Minimum 50x30 L<50
Maximum 500x300 1000≥l>500 or 450≥W>300
Thickness Thinnest 0.8 T<0.8
Thickest 5 T>5
Specification of SMT Component Outline Size Minimum Specifications 0603 (0201) 0602 (01005)
Maximum Size 45x45 45x45<Size≤68x68 (45x150)
Thickness of Component 25.4 T>25.4
QFP/SOP/SOJ/IC Socket etc. Minimum Distance of PIN Pitch=0.4 Pitch=0.3
CSP, BGA Minimum Distance of BGA Ball Pitch=0.5 0.3≤Pitch<0.5

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